Ama-chips angahlanganisa izingxenye eziningi ze-elekthronikhi ebhodini le-silicon ukwenza isekethe, ngaleyo ndlela afeze umsebenzi othile. Kuhlala kukhona amaphethini, izinombolo, njll. endaweni ye-chip ukuze ihlonzwe noma eminye imisebenzi. Kungakho imakethe idinga ukukwazi ukwenza ukumaka okunembe nokuningiliziwe kwe-chip laser endaweni encane kangaka ngaphandle kokucekela phansi izici zokusebenza ze-chip.
Umshini wokumaka we-IC chip laser unokunemba okuphezulu. Isekelwe ekumisweni kwemishini futhi ihlanganisa isistimu yokucubungula izithombe nekhadi lokucubungula isithombe sedijithali njengomnyombo, isistimu yokunyakaza elawulwa ikhadi lokulawula ukunyakaza kwe-multi-axis kanye nobuchwepheshe bokumaka bokuskena be-laser galvanometer obulawulwa yikhadi le-DSP ukuze kuzuzwe i-IC chip. ukumakwa kwe-laser kudinga ukunemba okuphezulu kanye nesivinini esikhulu.
Umshini wokumaka we-laser okhiqizwa yi-JINZHAO ungaqopha ngokucacile kuzo zonke izinto zensimbi nezingezona ezensimbi, ungalokothi unyamalale (ukugqokwa okungezona okungokomzimba), awulimazi impahla, futhi awuphazamisi umsebenzi womkhiqizo. Iwuhlobo lwekhodi ye-laser, umbhalo we-laser, i-laser Indlela yokucubungula ye-laser ingamaka imodeli, uphawu lwe-CE, inombolo ye-serial kanye nolunye ulwazi oluwusizo kubathengisi abangaphezulu kwe-IC chip, eyenza kube lula ukuhlonza ukulandeleka kanye nokuphikisana nomgunyathi, futhi ukubhala kucacile futhi ngeke kulimaze i-IC chip.
Sicela usithinte ukuze uthole imininingwane eyengeziwe.